Paper Title
Automatic Laser Micromachining using Binary Mask Projection

Abstract
The binary mask laser projection, Excimer laser micromachining using binary mask projection has been implemented for instant patterning of single micrometer features over large areas of various substrates. Simple limit for depth of focus that determines the depth to width aspect ratios is given and verified for different materials. Binary mask projection technique is found to conformally reproduce the mask features from the millimeter to the micrometer scale under proper focusing conditions. Large arrays of 1 μm and 15 μm holes on Kapton are made with high resolution and uniform periodicity. Material removal rate (MRR) for the laser machining of these holes are examined and the machining efficiency for these are found to have different dependence on the fluence. A saturation of hole-depth with increasing number of pulses is obtained. As object covered in this project the laser mask projection the device is controlled by the Automatic control system of the device as in the machine it is difficult to make mask of non- identical pattern for the laser masking, for the automatic adjustable device used in the machine for acquiring dissimilar pattern. Index terms - Binary Masking Method, Laser Projection, Microcontroller, Graphical User Interface, Serial Communication port, Control Circuit.